Day 1

April 3, 2023 (Monday)
Diamond Hall(22F), THE PLAZA Seoul

Opening Session

Co-chairs:

Jo-won Lee (NNFC) /
Myung S. Jhon (CMU)

08:30-09:00

Registration

09:00-09:20
(10min/each)

Welcoming Remark

• (ROK) Tae-Seog Oh (The1st Vice Minister, Ministry of Science and ICT)

• (USA) Andrew Herrup (Minister Counselor for  Economic Affairs, at US Embassy in Korea)

09:20-10:10
(25min/each)

Policy Direction on National Nanotechnology

• (ROK) Deok -Kee Kim (Director, National Research Foundation)
-  Nano & Semiconductor Technology Initiative and R&D in Korea

• (USA) Mihail Roco, (Senior Advisor, NSF and NNI)
-  Nanotechnology Foundation for Emerging Technologies

10:10-10:30

Coffee Break & Group Photo

10:30-11:45
(25min/each)

Keynote Speech

• (ROK) Kang-Wook Lee (Vice President, SK Hynix)
- The Role of Packaging Technology for Semiconductor Industry Innovation

• (USA) Farhang Shadman (Director of ERC, University of Arizona)
- Environmental Implications and Impact of Semiconductor Manufacturing: Retrospective and Outlook (Virtual Presentation using Zoom)

• (USA) Victor Zhirnov (Chief Scientist, Semiconductor Research Corporation)
- Decadal Plan for Semiconductors and Nanotechnology

11:45-12:45

Lunch & Informal Networking, Poster Set-up

Main Session

Chair:

Jinho Ahn (Hanyang University)

Next Generation Semiconductor
Ⅰ

Co-chairs:
Sanghun Jeon (KAIST) /
Elias Towe (CMU)

12:45-14:30
(15 min/each,
Incl. Q&A)

Introduction

• (ROK) Sanghun Jeon (Professor, KAIST)
-  Opportunity of Negative Capacitance Behavior in Flash Memory for High-Density and Energy-Efficient In-Memory Computing Applications

•  (USA) Elias Towe (Grobstein Professor, Carnegie Mellon University)
-  Challenges and Opportunities in Neuromorphic Computing

• (ROK) Sangbum Kim (Professor, SNU)
-  Device-Algorithm Co-optimization for Analog in-Memory Deep Learning

• (USA) Steve Koester (Russell J. Penrose Professor in Nanotechnology, University of Minnesota)
- Applications of 2D Materials in Future CMOS Nodes

• (ROK) Wooyoung Choi (Professor, SNU)
- Extremely-Low-Power Electron Devices and Their Applications to Brain-Inspired Computing and M3D Integration

• (USA) John Heron (Associate Professor, University of Michigan)
- Ferroelectric Switching Kinetics in Epitaxial PMN-PT Thin Film (Virtual Presentation using Zoom)

• (ROK) Sanghyeon Kim (Associate Professor, KAIST)
- Heterogeneous 3D Sequential CFET for Future logic

14:30~14:40

Coffee Break

Next Generation Semiconductor
Ⅱ

Co-chairs:

Sayoon Kang (KMEPS) /
Subramanian  Iyer
(UCLA)

14:40-16:25

(15 min/each,
Incl. Q&A)

Introduction

• (ROK) Sayoon Kang (President, The Korean Microelectronic and Packing Society)
-  How to Create the Values in Electronic Packaging for Semiconductor Competitiveness in Era of 4th Industrial Revolution

• (USA) Subramanian S. Iyer (Distinguished Chancellor’s professor, UCLA)
-  What really is Heterogeneous Integration?

• (ROK) Jichul Kim (Master, Samsung Electronics)
-  Advanced Packaging for Future Mobile Devices

• (USA) Ahmed Busnaina (University Distinguished professor, Northeastern University)
-  Additive Manufacturing of Micro and Nanoscale Electronics for Heterogenous Integration and Advanced Packaging

• (ROK) Jiho Kang (Fellow, SK hynix)
-  An Overview of the Past, Present and Future of 3D Device Technology

• (USA) Ming Zhang (Board Director, Wave Photonics)
-  The Future is Bright for Chips

• (ROK) Donghyun Kim (the Executive Vice President, Hana Micron)
-  Designing Chiplet-Based 2.5D High-Interconnect Density Semiconductor Packages: Challenges and Considerations

16:25-16:35

Coffee Break

The Environmental Implications of Semiconductor Manufacturing

Co-chairs

Heeyeop Chae (SKKU) /
Carolyn Duran
(Intel)

16:35-18:45
(15 min/each,
Incl. Q&A)

Introduction

• (USA) Mamadou Diallo (Program Director, NSF)
-  Environmental Implications of Semiconductor Manufacturing: Overview and NSF Funding Opportunities

• (ROK) Heeyeop Chae (Professor, SKKU)
-  Low Global Warming Gas Development for Plasma Etching Process in Semiconductor Device Fabrication

• (USA) Carolyn Duran (Vice President, Intel Corp.)
-  Sustainability and Future of Moore's Law

• (ROK) Jeong Sik Lim (Head, Research Center for Climate Metasphere)
-  High-speed and sensitive measurement techniques for monitoring of carbon net-zero type semiconductor and display process

• (USA) Carol Handwerker (Reingardt Schuhmann, Jr. Professor, Purdue University)
-  Closing the Sustainability Gap in Nano- and Microelectronics Research and Education

• (USA) Gill Lee (Managing Director, Applied Materials)
- Making Possible a Better Future

• (ROK) Sung-Il Cho (Master(VP of Technology), Samsung Electronics
-   Technology trends for Etch patterning in the aspect of energy and environment

• (USA) Ara Philipossian (Emeritus Professor, University of Arizona)
-  Reducing Slurry Consumption while Boosting Chemical Mechanical Planarization (CMP) Process Performance

18:45-19:00

Break & Banquet Set-up

19:00-21:00

Banquet & Welcoming Reception
Diamond Hall(22F), THE PLAZA Seoul

Day 2

April 4, 2023 (Tuesday)
Ruby/Opal Hall(22F), THE PLAZA Seoul, Seoul

Poster

Presentations

Co-chairs:
Jo-won Lee (NNFC) /
Myung S. Jhon (CMU)

(Opal Hall)

09:00-10:00
(5 min/each,
Incl. Q&A)

• (ROK) Hongyun So (Assistant Professor, Hanyang University)
-   Control of Electroplated Copper Layers for RDL Fabrication on PCB Substrates

• (USA) Jungwon Choi (Assistant Professor, University of Minnesota)
-  Wide Bandgap Devices in Power Electronics (Virtual Presentation using Zoom)

• (ROK) Jaemyung Lim (Assistant Professor, Hanyang University)
-  Power Delivery Network in the Advanced Packaging

• (USA) Jihoon Seo (Assistant Professor, Clarkson University)
-  Shallow Trench Isolation Chemical Mechanical Planarization: Slurry chemistry, Cleaning Chemistry, and Mechanisms

• (ROK) Min-Ju Kim (Assistant Professor, Dankook University)
-  Highly Reliable Organic Non-Volatile Memory Devices Based-on Hybrid Films via iCVD Process

• (USA) Inhee Lee (Assistant Professor, University of Pittsburgh)
-  Millimeter-Scale Smart Sensing Semiconductor Devices for Next-Generation IoT Applications

• (ROK) Byungjin Cho (Associate Professor, Chungbuk National University)
-  Low Power 2D/oxide Memtransistor Device with Highly Reliable Heterosynaptic Plasticity

• (USA) Siva Chandra Jangam (3DIC Technologist, Apple)
-  Advanced IC Packaging using Silicon Interconnect Fabric

• (ROK) Youngwoo Kim (Assistant Professor, Sejong University)
-  Signal and Power Integrity Design for Advanced Packages

• (ROK) Wonbo Shim (Assistant Professor, Seoul National University of Science and Technology)
-  3D NAND based Compute-in-memory Technology for Energy-efficient Processing of Huge AI Models

• (ROK) Haegyu Jang (Staff Engineer, Samsung Electronics)
-  Plasma Etching Chamber Analysis Technique and Its Application using Full-Spectrum Optical Emission Spectroscopy : Optimization of In-situ Cleaning & Stabilization

10:00-10:30

Coffee break & Poster Exhibition

Discussion /
Working Groups

10:30-12:30
(120min)

Group Discussion Workshop

• Group 1: Next Generation Semiconductor

• Group 2: Next Generation Semiconductor Ⅱ

• Group 3: The Environmental Implications of   Semiconductor Manufacturing

12:30-13:30

Lunch

Wrap up Discussion

13:30-14:00
(30min)

Presented by U.S. Session Chairs

Closing Session

14:00-15:00
(60min)

Poster Presentations Award

Draw-up Recommendation to the Governments

Signature of Overall Summary and Recommendation

Closing Remarks

Day 3

April 4, 2023 (Wednesday)
National NANOFAB Center in Daijeon

(Optional)
Technical Tour

(Name of organization: National NANOFAB Center in Daejeon)

09:00-11:00
(120min)

Move to Daejeon by bus

11:00-12:30
(90min)

FAB Tour

12:30-14:00
(90min)

Lunch

14:00-16:30
(150min)

Move to Seoul by bus