Welcome Remark
Tae-Seog Oh, The 1st Vice Minister, Ministry of Science and ICT (Korea)
Andrew Herrup, Minister Counselor for Economic Affairs, at US Embassy in Korea (USA)
Policy Direction on National Nanotechnology
Keynote Speech
Next Generation Semiconductor Session I
(USA)
(Korea)
- Sanghun Jeon, Professor, KAIST
Topic: Opportunity of Negative Capacitance Behavior in Flash Memory for High-Density and Energy-Efficient In-Memory Computing Applications
- Sangbum Kim, Associate Professor, Seoul National University
Topic: Device-Algorithm Co-optimization for Analog in-Memory Deep Learning
- Woo Young Choi, Associate Professor, Seoul National University
Topic: Extremely-Low-Power Electron Devices and Their Applications to Brain-Inspired Computing and M3D Integration
- Sanghyeon Kim, Associate Professor, KAIST
Topic: Heterogeneous 3D Sequential CFET for Future logic
Next Generation Semiconductor Session II
(USA)
(Korea)
- Sayoon Kang, President, The Korean Microelectronic and Packing Society
Topic: How to Create the Values in Electronic Packaging for Semiconductor Competitiveness in Era of 4th Industrial Revolution
- Jichul Kim, Master (VP of Technology), Samsung Electronics
Topic: Advanced Packaging for Future Mobile Devices
- Jiho Kang, Fellow, SK hynix
Topic: An Overview of the Past, Present and Future of 3D Device Technology
- Donghyun Kim, Director, Hana Micron
Topic: Designing Chiplet-Based 2.5D High-Interconnect Density Semiconductor Packages: Challenges and Considerations
The Environmental Implications of Semiconductor Manufacturing Session (USA)
- Mamadou Diallo, Program Director, NSF
Topic: Environmental Implications of Semiconductor Manufacturing: Overview and NSF Funding Opportunities
- Carolyn Duran, Vice President, Intel Corp.
Topic: Sustainability and Future of Moore's Law
- Carol Handwerker, Reingardt Schuhmann, Jr. Professor, Purdue University
Topic: Closing the Sustainability Gap in Nano- and Microelectronics Research and Education
- Gill Lee, Managing Director, Applied Materials
Topic: MAKING POSSIBLE A BETTER FUTURE
- Ara Philipossian, Emeritus Professor, University of Arizona
Topic: Reducing Slurry Consumption while Boosting Chemical Mechanical Planarization (CMP) Process Performance
(Korea)
- Heeyeop Chae, Professor, Sungkyunkwan University
Topic: Low Global Warming Gas Development for Plasma Etching Process in Semiconductor Device Fabrication
- Jeong Sik Lim, Head, Research Center for Climate Metasphere
Topic: High-speed and sensitive measurement techniques for monitoring of carbon net-zero type semiconductor and display process
- Sung-Il Cho, Master(VP of Technology), Samsung Electronics
Topic: Technology trends for Etch patterning in the aspect of energy and environment
Poster Presentation
(USA)
- Jungwon Choi, Assistant Professor, University of Minnesota
Topic: Wide Bandgap Devices in Power Electronics (Virtual Presentation)
- Jihoon Seo, Assistant Professor, Clarkson University
Topic: Shallow Trench Isolation Chemical Mechanical Planarization: Slurry chemistry, Cleaning Chemistry, and Mechanisms
- Inhee Lee, Assistant Professor, University of Pittsburgh
Topic: Millimeter-Scale Smart Sensing Semiconductor Devices for Next-Generation IoT Applications
- Siva Chandra Jangam, 3DIC Technologist, Apple
Topic: Advanced IC Packaging using Silicon Interconnect Fabric
(Korea)
- Hongyun So, Assistant Professor, Hanyang University
Topic: Control of Electroplated Copper Layers for RDL Fabrication on PCB Substrates
- Jaemyung Lim, Assistant Professor, Hanyang University
Topic: Power Delivery Network in the Advanced Packaging
- Min-Ju Kim, Assistant Professor, Dankook University
Topic: Highly Reliable Organic Non-Volatile Memory Devices Based-on Hybrid Films via iCVD Process
- Byungjin Cho, Associate Professor, Chungbuk National University
Topic: Low Power 2D/oxide Memtransistor Device with Highly Reliable Heterosynaptic Plasticity
- Youngwoo Kim, Assistant Professor, Sejong University
Topic: Signal and Power Integrity Design for Advanced Packages
- Wonbo Shim, Assistant Professor, Seoul National University of Science and Technology
Topic: 3D NAND based Compute-in-memory Technology for Energy-efficient Processing of Huge AI Models
- Haegyu Jang, Staff Engineer, Samsung Electronics
Topic:Plasma Etching Chamber Analysis Technique and Its Application using Full-Spectrum Optical Emission Spectroscopy : Optimization of In-situ Cleaning & Stabilization
Organizer
(USA)
- Myung S. Jhon, Carnegie Mellon University/Professor
- Elias Towe, Carnegie Mellon University/Professor
- Ahmed Busnaina, Northeastern University
(Korea)
- Jowon Lee, Hanyang University/Professor
- Wanho Song, Ministry of Science and ICT
- Jae Yong Song, National Research Foundation of Korea(NRF)/PM
- Chang Dong Yim, National Nanotechnology, Policy Center, Korea Institute of Materials Science/Head of Center
- Byung-ki Cheong, Green Technology Center/President, Korea Nano Technology Research Society(KoNTRS)/Vice President
- In-Hoo Kim, National Cancer Center/Professor
- Wan Doo Kim, Korea Institute of Machinery & Materials/Distinguished Research Fellow
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