The 19th U.S.-Korea Forum on Nanotechnology:
Sustainability in Semiconductor Manufacturing by Design and
Neuromorphic & Quantum Sensors on a Chip


Kintex, Gyeonggi-do, Korea

July 3(Thu.) ~ 4(Fri.), 2025


Home

General Information

Invitation

Participants

Program

Outcomes

Photo

eBook

 

Organizers

M.S. Jhon
(U.S.A.)
Carnegie Mellon University
mj3a@andrew.cmu.edu

Jinho Ahn (Korea)
Korea Nanotechnology Research Society

The 19th U.S.-Korea Forum on Nanotechnology:

Sustainability in Semiconductor Manufacturing by Design and

Neuromorphic & Quantum Sensors on a Chip

Kintex, Gyeonggi-do, Korea

Adopted on July 4, 2025

The first quarter of the 21st century has overflowed with the advent of nanotechnology convergence and its application in a broad spectrum of science and technology areas along with interdisciplinary research initiatives to achieve rapid advancement toward a fourth industrial revolution. To further promote the development of new technologies, the United States (National Science Foundation, NSF) and Korea (Ministry of Science and ICT, MSIT) have been encouraging a common platform for the exchange of ideas and research collaboration in nanotechnology through Forums, established via the recommendations made by the Korea-U.S. joint committee on Scientific and Technological Cooperation, held on October 31, 2002, in Seoul, Korea.

Since 2003, our Forums have been extremely successful, promoting development in nanotechnology. These Forums have been a testimony to the transformative power of identifying a concept or trend and laying out a vision at the synergistic confluence of diverse scientific research areas. Our Forums have successfully provided a common platform for effective networking between research communities and industries in both countries by identifying emerging areas in nanotechnology which generate significant impacts. This is evident from major collaboration initiatives between the U.S. and Korea established via our Forums. Organizing the Forums has expedited the generation of cutting-edge technologies for thrust areas in both countries.  To our knowledge, our Forum between the U.S. and Korea is the longest Forum of its kind. Our Forum, publicized through Carnegie Mellon website: http://www.cmu.edu/nanotechnology -forum/ has also served as a benchmark for other international forums.

With this mission, we established the 1st U.S.-Korea Forum on Nanotechnology, via NSF funding, on October 14th -18th of 2003, in Seoul. As the Korean counterpart to NSF, participation was overseen and funded by MSIT. The topics in the subsequent Forums were recommended by the advisory committee members depending on the needs of both countries at that time, and the locations of these Forums have alternated between Korea and the U.S. We organized the 2nd Forum, on nanomanufacturing research and the development of educational programs covering the field of nanotechnology. The 3rd Forum focused on active devices and systems research, unlike the passive systems studied during the first two Forums. We held the 4th Forum, where the focus was on sustainable nano energy with emphasis on the design and characterization of materials as well as devices and systems for energy applications. The 5th Forum focused on the emerging area of nano-biotechnology emphasizing novel nano-biomaterials, instrumentation technologies, and integrated systems for overcoming critical challenges in biomedicine and delivery of healthcare, as well as their environmental, health & safety (EHS), and toxicity issues. The 6th Forum dealt with nano-electronics with emphasis on fundamentals as well as integration with applications including convergence technology with biotechnology. The 7th Forum oversaw discussions ranging in nanotechnology convergence with current and future energy technologies to provide environmentally friendly solutions to the crippling challenges facing the energy sector. These seven Forums culminated in a seamless developmental and feedback process documenting the advent of nanotechnology convergence in broad spectrum of science and technology areas, for the first decade of the 21st century (NANO1). The 8th Forum in 2011, on nanotechnology convergence in sustainability, heralded new horizons in nanotechnology for the next decade (NANO2) by addressing critical problems faced by an ever-increasing global population, with an emphasis on environmentally friendly technologies for the future on nanotechnology for sustainability, focusing on water reuse and desalination, greenhouse gas capture and conversion, and sustainable natural resources. The 9th Forum focused on channeling nanotechnology to the masses to responsibly address broad societal challenges such as nanoscience fundamentals, sustainability, and state-of-the-art applications for the new generation of nanotechnology products. The 10th Forum focused on laying out a roadmap for a new generation of nanotechnological products and processes. The 11th Forum focused on a new paradigm in nanomanufacturing, nanocomposite, and nanoinformatics. This Forum provides an opportunity to realize the potential of nanotechnology through the development of innovative and sustainable nanomanufacturing technologies for producing novel strong, light and smart nanocomposites and their management via nanoinformatics which will likely lead to paradigm shifting next generation enhanced performance of products in a broad range of existing industries including aerospace, automotive, energy, environmental remediation, information, and power industries as well as development of new industries. The 12th Forum focused on laying out a roadmap for a new paradigm in nanoscience-convergence in 2-D materials and for water purification via exploring improvements to technological tools for the application of nanotechnology and functional and novel nanomaterials to water-related topics. The 13th Forum focused on a new paradigm in nanoscience- convergence in brain-inspired (neuromorphic) computing and water & energy. The 14th Forum focused on laying out a roadmap for a new paradigm in nanoscience-convergence including nanosensors and neuromorphic computing. The 15th Forum was focused on laying out a roadmap for a new paradigm in nanomedicine area as well as continuing effort on nanosensors including IoT devices. The 16th Forum held in 2019 focused on realizing the promise of nanotechnology through the development of novel nanomedicine focusing at the single-cell level as well as sensors related to human cognition and brain research. We could not hold the Forum for three years due to the COVID-19 pandemic. The 17th Forum held in 2023 explored next-generation semiconductors and the environmental implications of semiconductor manufacturing. In this Forum, we discussed the development of advanced semiconductor devices for emerging neuromorphic in-memory computing, future CMOS nodes, monolithic 3D (M3D) integration, advanced packaging (design, manufacturing, and technology), and heterogeneous integration.

This 18th Forum held in 2024 further explored advanced semiconductor and sensor technology by examining sustainability in semiconductor manufacturing and sensors related to human cognition.

This 19th Forum was held at Kintex, Korea on July 3 & 4, 2025. Eighty-seven eminent scientists and policy-makers in the field of semiconductors and nanotechnology attended. During this Forum, Welcoming Remarks were provided by Taek-ryeol Jeong, the Director General of Ministry of Science and ICT, and Seongsin Margaret Kim, Program Director of the National Science Foundation. The main event of the Forum consisted of four different sessions, described below.

Keynote Session: The 19th Korea-U.S. Forum on Nanotechnology opened with Professor John A. Rogers of Northwestern University setting the tone by discussing his study of 3D and transient semiconductor nanomaterials. Prof. Rogers showed wafer-scale assemblies that fold like kirigami to create mechanically compliant, high-performance electronics able to laminate onto curved or moving surfaces. Equally compelling were “microfliers”: grain-of-sand-sized sensor platforms that ride on the wind and dissolve in rainwater, leaving no environmental trace. On the biomedical front, he unveiled the world’s smallest, fully bioresorbable pacemaker, already in first-in-human trials, that melts harmlessly after a post-operative healing window. Rogers stressed that sustainability in nanotechnology is not only about cleaner fabs but also about designing devices whose entire life cycle, including end-of-life, honors ecological constraints. Dr. Seongsin Margaret Kim, Program Director in the National Science Foundation’s Electronics, Photonics, and Magnetic Devices program, spoke next. Dr. Kim shifted the conversation towards quantum networking and quantum sensing, which are poised to do for data acquisition what classical communications did for data transport. She traced how entanglement-enabled magnetometers and gravimeters are already breaching classical sensitivity limits, then sketched NSF’s cross-agency roadmap for moving laboratory prototypes into deployable field systems. By coupling quantum sensors to emerging photonic network backbones, she forecast real-time, distributed measurements that could transform biomedical diagnostics, climate monitoring, and secure defense platforms. The next address was delivered by Dr. Heung Soo Park, President of Korea’s National NanoFab Center (NNFC). Dr. Park reframed quantum ambition in the practical language of manufacturing capacity. Public nanofabs, he argued, are the connective tissue between discovery and deployment. Detailing NNFC’s 5,000 m² open-access clean-room, he showed how Korean startups and university researchers prototype silicon, MEMS, biosensor, and display technologies at wafer-scale without the prohibitive capital costs borne by private fabs. He highlighted a new bilateral program that stations Korean graduate students at IMEC and U.S. faculty at NNFC, along with a just-signed agreement with NY CREATES that gives American small businesses time-critical test-bed access in Daejeon. Dr. Park closed by pledging that NNFC will expand into heterogenous integration, quantum‐compatible cryo-CMOS, and “green-chemistry” process lines—all under a “safety-first, sustainability-always” ethic. A keynote address from Professor Kwabena Boahen of Stanford University tackled the soaring energy requirements of artificial intelligence. Prof. Boahen contrasted today’s synapse-centric AI accelerators—where communication energy rises quadratically with multiplier count—with the human brain, whose dendrite-centric architecture scales energy nearly linearly with neuron count and runs on just 25 W. He introduced a “dendrocentric” computing model that sparsifies signals via sequence detection rather than dense dot-products, allowing knowledge processing to migrate from two-dimensional chips toward 3D, brain-like substrates. In Boahen’s projection, reaching human-scale AI systems (1015 parameters) within the decade is feasible—but only if architects embrace vertical integration, sparse interconnects, and new learning rules that slash inter-die traffic. In the final keynote, Dr. Victor Zhirnov, Chief Scientist of the Semiconductor Research Corporation, tied the week’s scientific aspirations back to industrial imperatives. Citing surging global demand and the CHIPS and Science Act’s $280 billion investment, Zhirnov argued that digital twins are the linchpin for re-establishing U.S. leadership in high-volume, high-mix manufacturing. He outlined the SMART USA Manufacturing Institute, a proposed public–private consortium that will stitch together unit-process models, fab-floor sensors, supply-chain analytics, and workforce training into hierarchical virtual replicas—from individual deposition chambers up to global logistics networks. These twins, he contended, can cut development cycles in half, flag yield excursions before wafers scrap, and give engineers “X-ray vision” into the nanoscale physics of every step.

Session #1: Professor Ahmed Busnaina introduced an environmentally friendly approach to electronics manufacturing that uses nanoparticle assembly to dramatically reduce production costs by as much as 10-to-100 times compared to traditional semiconductor methods. His process operates at room temperature and eliminates the need for toxic chemicals or corrosive substances. It offers high precision in nanomaterial production and is especially well-suited for advanced 3D heterogeneous integration, all while significantly lowering environmental impact. Professor Hak-Sung Kim presented groundbreaking work in ultra-fast flip-chip bonding using intense pulsed light. This millisecond-scale process reduces energy consumption by 40% and improves mechanical reliability by 30% compared to conventional reflow techniques. It also significantly decreases the thickness of intermetallic compounds, shrinking them from 6 micrometers to just 800 nm. Professor Paul Westerhoff addressed major challenges in recycling semiconductor wastewater, particularly the presence of trace organic contaminants that hinder reuse. His research demonstrated innovative advanced oxidation processes using sulfate and bromide radicals. These techniques effectively break down stubborn compounds like urea, TMAH, and acetone, making previously unusable wastewater viable for reuse in chip manufacturing. Professor Jin-Seong Park introduced a data-driven framework for creating more sustainable area-selective atomic layer deposition processes. By leveraging density functional theory to optimize molecular inhibitors and developing a novel S-factor metric, his approach connects theoretical predictions with actual results. This helps reduce material waste and avoids the need for etching after deposition. Professor Fazleena Badurdeen explored how circular economy strategies can advance sustainability in semiconductor manufacturing. She examined issues in the industry's fragmented supply chains and highlighted emerging initiatives focused on collecting, recovering, and repurposing end-of-life microelectronic components. Her work identifies key intervention points to improve sustainability across the full manufacturing lifecycle. Professor Jungwan Cho discussed electro-thermal co-design techniques for high-power semiconductor devices where local power densities can reach several megawatts per square centimeter. His research employs advanced thermoreflectance methods to build predictive models that support the development of thermally-aware device structures, improving both performance and reliability. Professor Sung Kyu Lim showcased AI-driven co-optimization techniques for heterogeneous AI chips. His work demonstrates how machine learning models can predict the relationships between manufacturing parameters and system performance, enabling simultaneous optimization of fabrication processes and chip design for next-generation technologies. Professor Jiyoung Kim highlighted the use of machine learning to accelerate optimization of atomic layer deposition. His deep neural network framework helps reduce the need for extensive experimental testing while accurately predicting film quality, offering a more efficient and cost-effective path to process development. Finally, Dr. Pascal Oberndorff concluded with insights into the growing importance of electronic packaging in enabling future semiconductor technologies. He emphasized its role in miniaturization and cost-effectiveness, especially for edge computing systems, and shared practical examples of material selection and modeling strategies that support advanced heterogeneous integration.

Session #2: Professor Elias Towe’s (Carnegie Mellon University) talk discussed Solid-state Quantum Magnetometers. He mentioned that diamonds and SiC are perfect for making magnetometers. His goal is to create a sufficiently small magnetometer that can be made into a wearable cap to measure magnetic waves from a brain, likely not from diamond but SiC. Professor Gyoujin Cho, from Sungkyunkwan University, began with the background of his school. He is working on Organo-Array, disposable quantum sensors, large-scale additive manufacturing, and roll-to-roll platform (LAMP) for sticker-like computers, microfluidic chip, to detect protein sequences for in-situ detection, for d-PCR and Q-spin sensor DNA sequencing, all to be done in an on-skin patch. Dr. Darmindra Arumugam, from Jet Propulsion Laboratory, California Institute of Technology, discussed how remote sensing is constrained by data throughput, specifically from satellites. He highlighted the need for high spatial and temporal resolution. His talk addressed that Rydberg states/architecture enable high sensitivity, dynamic, and tunable radar remote sensing throughout the entire radio window, and hence can be used as reconfigurable/reprogrammable, active & passive sensors. Professor Douglas Weber, also from Carnegie Mellon University, presented a talk entitled “Sensing and Stimulating the Brain to Restore Neurological Function”, featuring two topics of clinical applications for brain-machine interfaces (BMI): (a) brain-sensing devices & (b) brain-stimulating devices. For brain-sensing devices, he discussed his focus on intracortical BMI implants, used for patient training, signal pre-processing, before BMI use. He showed a video of patients with ALS that have BMI implants using a cell phone to control other devices. Related to brain-stimulating devices, he discussed results of implants used to stimulate motor neurons weakened by the stroke. Professor Yang-Kyu Choi’s (Korea Advanced Institute of Science and Technology) presentation was titled “Rethinking Transistor Operation for Oscillating and Spiking Behavior”, where he discussed capacitor-less, single transistor dynamics. His CMOS-based artificial neuron is based on a single transistor latch (STL). He discussed the operation principle of such leaky-integrate-fire neuron, based on a channel slowly charging, and then rapidly discharging. He showed neurons used for sensing: pressure (touch/tactile, triboelectric), gas (olfactory, H2, NH3), light (visual),  breath (sound; triboelectric – Al/PTFE/PI), molecule (taste: vinegar, brine), for in-sensor computing, and also used as a random-number generator. Professor Euisik Yoon, from the University of Michigan, discussed electrophysiology and optimal neuromodulation at cellular resolution. He discussed his research on deep-brain interfaces and aims to address its very invasive nature. He developed sensors with optical waveguides integrated onto a Si wafer with laser diodes (of blue and red color). He discussed his results with bi-colored electrodes, used to turn neurons on and off (he showed videos showing LEDs synchronized to Mozart and Beethoven’s music). Professor Dmitri Strukov’s (University of California, Santa Barbara) talk included lots of mathematics, equations, and algorithm/computing, demonstrating his efforts on combinatorial optimization. His work addressed solving problems in native high-order function, which can be done on hardware, for hardware acceleration, done using crossbar memory circuit (memristor), but also 256x128 10T bi-directional SRAM array. While his approach did not produce faster or more energy-efficient solutions, he believes it is scalable, meaning for larger problems it should be more advantageous. Professor Seong Jun Kang, from Kyung Hee University, discussed the band structure of oxide semiconductors for optical neuromorphic devices to realize highly efficient and accurate machine vision. He discussed how to control band structure (gap states, wide bandgap oxides: IGZO vs IGZO:Cd300) in oxide structures for neuromorphic computing, to make neuromorphic, in-sensor computing photodetectors. He used persistent photocurrent (PPC) effects to make an optical synapse and showed that Cd-doped IGZO works better than IGZO because of the amount of PPC. He also showed that excitatory postsynaptic current (EPSC) and paired-pulse current, modulating the amount of defects, allows for tunable photocurrent. He showed preliminary results of the use of this device for machine vision where the data is processed optically instead of electrically. Emeritus Professor from the University of Texas at Dallas, Bruce Gnade, discussed neuromorphic vision sensors (neuromorphic sensors merely looking for and detecting change; should be low power and low data band but are very noisy because the FET is run in analog state, and then amplified, noting neuromorphic pixels do not behave the way you’d expect (kind of like in a brain): e.g., in dark, but it takes a while to charge the input cap). He discussed his system, a task specific hardware-in-the-loop testing system. In this presentation he discussed the test system, its requirements and behavior, as well as the measurement of the temporal and spatial response of a neuromorphic sensor.

Poster Session: Hongseok Oh introduced physical reservoir computing using photonic synapses with fading memory for efficient time-series processing. Mikael P. Backlund explored nanoscale quantum imaging using nitrogen-vacancy centers and fluorescent dyes for correlative magnetic resonance and fluorescence microscopy. Guesuk Lee demonstrated thermoreflectance-based temperature profiling and structure analysis for multilayer ICs, providing insight into thermal behavior in 2.5D/3D packaging. Robert Nawrocki presented flexible organic spiking neuromorphic circuits that emulate biological neural activity, enabling embodied AI in soft robotics. Hyunjeong Kwak discussed a monolithically integrated 4K electrochemical RAM (ECRAM)-based analog AI chip capable of on-chip training with high energy efficiency, marking a breakthrough in neuromorphic hardware scalability. Youjin Reo developed high-performance tin halide perovskite transistors via thermal evaporation of CsSnI3, achieving high mobility (~33.8 cm2/V· s), excellent stability, and large-area uniformity, bridging the gap between solution-based processes and industrial scalability. Matthew Flavin introduced bistable, self-sensing wearable haptics that transmit information through the skin, with applications in neurorehabilitation. Jaeduk Han revealed a PAM-8 transceiver for ultra-fast communication and LAYGO, an AI-augmented automated layout tool that boosts productivity in chip design, offering solutions for the growing complexity of AI-driven system-on-chip (SoC) designs. Jung-Hoon Lee introduced a novel tin precursor for ALD-based SnO2 fabrication, enhancing gas sensor performance. Inhee Lee presented millimeter-scale neuromorphic vision systems using CNNs and dynamic neural fields, driving intelligent sensing in ultra-small IoT devices. Sung Beom Cho integrated DFT, MD, FEM, and AI to build predictive multiscale models for Ga2O3 processing, addressing polymorph control and device reliability. Dong-Woo Jee presented in-sensor processing for biomedical devices, including a PPG sensor and retinal prosthesis chip that embed neural computation directly within pixels. Jihoon Seo emphasized sustainability in semiconductor manufacturing through eco-friendly CMP slurry formulations and life-cycle assessments. Hyejin Park developed a printed NIR image sensor label inspired by locust vision, offering low-cost collision avoidance for robotic arms. Joonhee Choi highlighted advances in solid-state quantum sensing with rare-earth ions and 2D materials for probing quantum many-body interactions. Younsu Jung showcased the world’s first roll-to-roll (R2R) printed 4-bit flexible microprocessor using SWCNT-based transistors, paving the way for sustainable and scalable electronics.

To explore semiconductor and sensor technology further, we intend to organize the 20th Forum next year to be held in Raleigh, North Carolina. The topic includes two emerging themes: energy-efficient neuromorphic and quantum-sensing systems on a chip. We are confident that the 20th Forum will provide a gateway for opening a new paradigm in semiconductors, AI, and quantum applications for the future as both the new governments of the U.S. and Korea have been heavily supporting these technologies as a prioritized economic development area. We also believe that the continuation of these technologies during the 20th Forum will further promote collaboration between scientists in both countries.

The following are the detailed recommendations made by the two sessions during this Forum:

Session 1: Sustainability in Semiconductor Manufacturing by Design

1. Sustainability in Semiconductor Manufacturing

1.1. Life Cycle Assessment Framework Development

  • Business case development for sustainability measurement
  • Water identified as the largest chemical/solvent component
  • Need for comprehensive assessment metrics and frameworks

1.2. Recycling and Reuse Challenges

  • Post-consumer recycling difficulties, particularly for packaging
  • Reuse potential for legacy chips
  • Business case challenges for recycling due to chip design specificity
  • Balance between performance requirements and sustainability goals

1.3. Systemic Approach and Collaboration

  • International framework and organizational structure needs
  • Energy vs. water tracking challenges (local policy vs. financial considerations)
  • Supply chain collaboration requirements (suppliers, vendors, users)
  • Business model development necessity

The focus has evolved from identifying sustainability areas (last year) to developing practical implementation frameworks - specifically life cycle assessment, business cases, and collaborative ecosystems.

The emphasis has shifted toward Sustainability by design with performance balance and the development of assessment matrices for materials replacement.

2.  E-Waste: recover, reuse, recycle

  • Focus on designing chips for better end-of-life management
  • Recognition that logistics is a major missing component with significant impact potential
  • Redesigning chips for improved recovery, reuse, and recycling capabilities, and Rethinking efficiency and energy use while maintaining performance standards
  • Sustainable materials and packaging: Focus on new materials during design phase, recognition that current packaging approaches are not suitable for end-of-life management
  • Implementation of AI models for sustainable manufacturing and chip design processes, leveraging existing investments in chip technology

The focus has evolved from end-of-life treatment (last year) to design-phase integration (this year): (1) New focus on supply chain and logistics as critical missing elements, (2) Introduction of AI models for sustainability optimization, (3) Evolution from traditional recycling focus to comprehensive circular design approaches.

3. Opportunities for additive manufacturing (AM) - Specifically, its current state, potential applications, and challenges in nanotechnology and semiconductor fabrication.

  • Now capable of printing metals and polymers, even for critical components (e.g., military and aerospace parts).
  • Materials and Process Innovations:
  • Focus on achieving single-crystal or polycrystalline metals via AM
  • Challenge: Additive manufacturing of semiconductors still requires single crystal structure for performance, unlike dielectrics where amorphous is acceptable.
  • Desire to achieve properties equivalent to CVD/PVD-deposited materials using AM.

Session 2: Neuromorphic & Quantum Sensors on a Chip

Discussions on Sensor Topics

  • More time designated for discussion
  • More short talks + discussion, fewer lectures
  • Broad collection of topics was a great thing
  • Need more time to digest. Perhaps have discussions hours or day after talks.
  • Rearrange so not all keynotes on one day and discussion on second day --> redistribute between days
  • More discussion of background on various topics is needed – pedagogical intro to different fields
  • Description of open questions in various fields
  • Some parallelization (separate rooms) could make room for more discussion
    -  Others liked having everyone together
  • Technology talks—hard to tell how far from application. A primer ahead of time perhaps could help.
  •  Invite a couple people from industry
    -   Industry people may be hesitant to discuss emerging technology
    -  Management might not allow

On collaboration

  • Summary of areas and bios will facilitate collaboration
  • NSF views US-Korea collaboration favorably. Will continue in long run.
  • NSF has mechanisms in place for collaboration with agencies in different countries (UK, Israel, Switzerland) but some hurdles to establishing such a program with Korea.
  • Impetus for collaboration has often come from Korean agencies, with specific incentives for foreign collaboration
  • Student exchange program can stimulate collaboration
  • U.S. air force has similar collaboration mechanisms. ONR Global. Other US agencies. Industry partners to support research?
  • IP law makes dually supported research complicated
  • Should we do some government outreach as part of this meeting?
  • From NSF side, creating a collaborative program with Korea is much more likely if it focuses on NSF’s ~5 stated research area priorities.
  • Literature summarizing previous successful programs along these lines would be helpful

Possible topics for next years’ meeting

  • Space Specifically semiconductors in space.

Shall we keep the same topics for next year? Benefits to the continuity

Energy-efficient neuromorphic quantum. Energy ties all topics together.

Summary:

  • We suggest a redistribution of the agenda between the two days, including more time for discussion.
  • Generally, everyone is positive about the breadth of topics. It would be helpful to include more pedagogical introduction to the various topics, as well as a description of open questions in the field.
  • A summary of previous collaboration to emerge from this Forum, or of previous programs supporting similarly spirited collaboration would provide some helpful perspective. Hearing from previous participants would also help along these lines.
  • Funding uncertainty complicates what specific actions NSF can commit to, but explicitly connecting to stated “priorities” would be helpful.
  • Some continuity in the topics from this year to next would likely be more impactful than an entirely new slate.

 

      On behalf of the U.S participants

      On behalf of the Korean participants

      Myung S. Jhon, Professor
      Carnegie Mellon University
      Pittsburgh, PA, USA

      Jinho Ahn
      Korea Nanotechnology Research Society
      Seoul, Korea