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Day 1
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April 3, 2023 (Monday) Diamond Hall(22F), THE PLAZA Seoul
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Opening
Session
Co-chairs:
Jo-won Lee
(NNFC) / Myung S.
Jhon (CMU)
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08:30-09:00
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Registration
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09:00-09:20 (10min/each)
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Welcoming Remark
•
(ROK) Tae-Seog Oh (The1st Vice Minister, Ministry of
Science and ICT)
• (USA) Andrew Herrup (Minister Counselor for Economic Affairs, at US Embassy in Korea)
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09:20-10:10 (25min/each)
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Policy Direction
on National Nanotechnology
• (ROK) Deok
-Kee Kim (Director, National Research Foundation) - Nano & Semiconductor Technology Initiative and R&D in Korea
• (USA) Mihail Roco, (Senior Advisor, NSF and NNI) - Nanotechnology
Foundation for Emerging Technologies
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10:10-10:30
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Coffee Break &
Group Photo
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10:30-11:45 (25min/each)
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Keynote Speech
• (ROK) Kang-Wook Lee (Vice President, SK Hynix) - The Role of Packaging Technology for
Semiconductor Industry Innovation
• (USA) Farhang
Shadman (Director of ERC, University of Arizona) - Environmental
Implications and Impact of Semiconductor Manufacturing: Retrospective and
Outlook (Virtual Presentation using Zoom)
• (USA) Victor Zhirnov (Chief Scientist, Semiconductor
Research Corporation) - Decadal Plan
for Semiconductors and Nanotechnology
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11:45-12:45
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Lunch &
Informal Networking, Poster Set-up
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Main Session
Chair:
Jinho Ahn (Hanyang
University)
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Next Generation Semiconductor
Ⅰ
Co-chairs: Sanghun Jeon (KAIST) / Elias Towe (CMU)
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12:45-14:30 (15 min/each, Incl. Q&A)
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Introduction
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• (ROK) Sanghun Jeon (Professor, KAIST) - Opportunity of Negative Capacitance Behavior in Flash Memory for High-Density and Energy-Efficient In-Memory Computing Applications
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• (USA) Elias Towe (Grobstein Professor, Carnegie Mellon
University) - Challenges and
Opportunities in Neuromorphic Computing
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• (ROK) Sangbum Kim (Professor, SNU) - Device-Algorithm Co-optimization for Analog in-Memory Deep Learning
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• (USA) Steve Koester (Russell J. Penrose Professor in Nanotechnology, University of Minnesota) - Applications
of 2D Materials in Future CMOS Nodes
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• (ROK) Wooyoung Choi (Professor, SNU) - Extremely-Low-Power
Electron Devices and Their Applications to Brain-Inspired Computing and M3D
Integration
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• (USA) John Heron (Associate Professor, University of
Michigan) - Ferroelectric Switching Kinetics in Epitaxial
PMN-PT Thin Film (Virtual Presentation using Zoom)
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•
(ROK) Sanghyeon Kim (Associate Professor, KAIST) - Heterogeneous 3D Sequential CFET for Future logic
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14:30~14:40
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Coffee Break
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Next Generation Semiconductor
Ⅱ
Co-chairs:
Sayoon Kang (KMEPS) / Subramanian Iyer (UCLA)
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14:40-16:25
(15 min/each, Incl. Q&A)
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Introduction
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• (ROK) Sayoon Kang (President, The
Korean Microelectronic and Packing Society) -
How to Create the Values in Electronic Packaging for Semiconductor Competitiveness in Era of 4th Industrial Revolution
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•
(USA) Subramanian
S. Iyer (Distinguished Chancellor’s professor, UCLA) -
What really is
Heterogeneous Integration?
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• (ROK) Jichul Kim
(Master, Samsung Electronics) -
Advanced Packaging for Future Mobile Devices
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•
(USA) Ahmed
Busnaina (University Distinguished professor, Northeastern University) -
Additive
Manufacturing of Micro and Nanoscale Electronics for Heterogenous Integration
and Advanced Packaging
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•
(ROK) Jiho Kang
(Fellow, SK hynix) -
An Overview of the Past, Present and Future of 3D Device Technology
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•
(USA) Ming Zhang
(Board Director, Wave Photonics) -
The Future is
Bright for Chips
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• (ROK) Donghyun Kim
(the Executive Vice President, Hana Micron) -
Designing Chiplet-Based 2.5D High-Interconnect Density Semiconductor Packages: Challenges and Considerations
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16:25-16:35
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Coffee Break
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The Environmental Implications of Semiconductor
Manufacturing
Co-chairs
Heeyeop Chae (SKKU) / Carolyn Duran
(Intel)
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16:35-18:45 (15 min/each, Incl. Q&A)
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Introduction
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•
(USA) Mamadou
Diallo (Program Director, NSF) -
Environmental
Implications of Semiconductor Manufacturing: Overview and NSF Funding
Opportunities
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•
(ROK) Heeyeop Chae (Professor, SKKU) -
Low Global Warming Gas Development for Plasma
Etching Process in Semiconductor Device Fabrication
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•
(USA) Carolyn Duran
(Vice President, Intel Corp.) -
Sustainability
and Future of Moore's Law
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•
(ROK) Jeong Sik Lim
(Head, Research Center for Climate Metasphere) -
High-speed and
sensitive measurement techniques for monitoring of carbon net-zero type semiconductor
and display process
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•
(USA) Carol
Handwerker (Reingardt Schuhmann, Jr. Professor, Purdue University) -
Closing the
Sustainability Gap in Nano- and Microelectronics Research and Education
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• (USA) Gill Lee (Managing Director, Applied
Materials) - Making Possible a Better Future
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•
(ROK) Sung-Il Cho (Master(VP of Technology), Samsung Electronics - Technology trends for Etch patterning in the aspect of
energy and environment
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•
(USA) Ara Philipossian (Emeritus Professor,
University of Arizona) - Reducing
Slurry Consumption while Boosting Chemical Mechanical Planarization (CMP)
Process Performance
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18:45-19:00
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Break & Banquet Set-up
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19:00-21:00
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Banquet & Welcoming Reception Diamond Hall(22F), THE PLAZA Seoul
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Day 2
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April 4, 2023
(Tuesday) Ruby/Opal
Hall(22F), THE PLAZA Seoul, Seoul
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Poster
Presentations
Co-chairs: Jo-won Lee (NNFC) / Myung S. Jhon (CMU)
(Opal Hall)
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09:00-10:00 (5 min/each, Incl. Q&A)
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• (ROK) Hongyun So (Assistant Professor, Hanyang
University) - Control of
Electroplated Copper Layers for RDL Fabrication on PCB Substrates
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•
(USA) Jungwon Choi
(Assistant Professor, University of Minnesota) -
Wide Bandgap
Devices in Power Electronics (Virtual
Presentation using Zoom)
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•
(ROK) Jaemyung Lim
(Assistant Professor, Hanyang University) -
Power Delivery
Network in the Advanced Packaging
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• (USA) Jihoon Seo
(Assistant Professor, Clarkson University) -
Shallow Trench
Isolation Chemical Mechanical Planarization: Slurry chemistry, Cleaning
Chemistry, and Mechanisms
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• (ROK) Min-Ju Kim (Assistant Professor, Dankook University) - Highly
Reliable Organic Non-Volatile Memory Devices Based-on Hybrid Films via iCVD
Process
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•
(USA) Inhee Lee
(Assistant Professor, University of Pittsburgh) -
Millimeter-Scale
Smart Sensing Semiconductor Devices for Next-Generation IoT Applications
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•
(ROK) Byungjin Cho (Associate Professor, Chungbuk National University) - Low
Power 2D/oxide Memtransistor Device with Highly Reliable Heterosynaptic
Plasticity
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• (USA) Siva Chandra Jangam (3DIC Technologist, Apple) - Advanced IC
Packaging using Silicon Interconnect Fabric
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• (ROK) Youngwoo Kim (Assistant Professor, Sejong University) - Signal
and Power Integrity Design for Advanced Packages
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• (ROK) Wonbo Shim (Assistant Professor, Seoul National University
of Science and Technology) - 3D
NAND based Compute-in-memory Technology for Energy-efficient Processing of Huge
AI Models
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• (ROK) Haegyu Jang (Staff Engineer, Samsung Electronics) - Plasma Etching Chamber Analysis Technique and Its Application using Full-Spectrum Optical Emission Spectroscopy : Optimization of In-situ Cleaning & Stabilization
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10:00-10:30
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Coffee break & Poster Exhibition
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Discussion
/ Working
Groups
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10:30-12:30 (120min)
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Group Discussion Workshop
•
Group 1: Next Generation
Semiconductor
•
Group 2: Next
Generation Semiconductor Ⅱ
• Group 3: The
Environmental Implications of Semiconductor Manufacturing
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12:30-13:30
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Lunch
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Wrap up Discussion
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13:30-14:00 (30min)
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Presented by U.S. Session Chairs
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Closing Session
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14:00-15:00 (60min)
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Poster Presentations Award
Draw-up Recommendation to the Governments
Signature of Overall Summary and Recommendation
Closing Remarks
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Day 3
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April 4, 2023
(Wednesday) National NANOFAB Center in Daijeon
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(Optional) Technical Tour
(Name of
organization: National NANOFAB Center in Daejeon)
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09:00-11:00 (120min)
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Move to Daejeon by bus
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11:00-12:30 (90min)
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FAB Tour
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12:30-14:00 (90min)
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Lunch
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14:00-16:30 (150min)
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Move to Seoul by bus
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