Following the laboratory scale philosophy of polishing one wafer at a time, is very expensive at an industrial scale. The amount of time, and the consumables required to judiciously tailor the process makes it impossible to use a simple bench top polisher. Again, the particle augmented mixed lubrication (PAML) approach is being employed to model the complex multi-component interaction and the resulting variation in material removal. Oscillating-carrier polishers, which try to replicate the motion of a wafer in an industrial polisher, are also studied.
Srivastava, G., and Higgs III, C. F., "The Thermal Effects of CMP as a Particle Augmented Mixed Lubrication Tribosystem", Materials Research Society Symposium Proceedings, 2013