The material science of CMP: microstructure of thin metal films

The mechanical properties of thin metal films in nanoscale integrated circuits vary with microstructure. These variables need to be considered when predicting the chemical mechanical polishing (CMP) during nanomanufacturing. 

PFTL Researcher(s): Sarah Neyer

Method(s) employed: OIM, SEM, XPS, nano-characterization, contact mechanics, wear, PAML 

Sponsor(s): NSF/CMU MRSEC

Reference(s): Bonivel, J., Biltz, S., Terrell, E., Ozdoganlar, B., and Higgs, C.F., "The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals," ASME/STLE Joint Tribology Conference, 2007.