Gary Fedder-Mechanical Engineering - Carnegie Mellon University

Gary Fedder

Associate Dean for Research, CIT, Director of the Institute for Complex Engineered Systems (ICES), the Howard M. Wilkoff Professor of Electrical and Computer Engineering, and Professor of the Robotics Institute

Courtesy Appointment, Mechanical Engineering, Biomedical Engineering

Address:
1201C Hamburg Hall
Carnegie Mellon University
5000 Forbes Avenue
Pittsburgh, PA 15213
Phone: 412-268-8443/5352
Fax: 412-268-5229

Bio

Dr. Fedder earned his B.S. and M.S. degrees in EECS from MIT in 1982 and 1984, respectively. From 1984 to 1989, he worked at the Hewlett-Packard Company on circuit design and printed-circuit modeling. In 1994, he obtained the Ph.D. degree from the University of California at Berkeley, where his research resulted in the first demonstration of multimode control of an underdamped surface-micromachined inertial device. His research interests include design and modeling of microsensors and microactuators, fabrication of integrated MEMS with electronic circuits using conventional CMOS processing, and implantable microsystems. In 2007, he was elevated to IEEE Fellow for contributions to integrated micro-electro-mechanical-system processes and design methodologies. His awards include the 1993 AIME Electronic Materials Society Ross Tucker Award, the 1996 Carnegie Institute of Technology George Tallman Ladd Research Award, and a 1996 NSF CAREER Award.

Currently, he serves as a senior editor for the IEEE/ASME Journal of Microelectromechanical Systems, on the editorial boards of the IoP Journal of Micromechanics and Microengineering, and IET Micro & Nano Letters, and as co-editor of the Wiley-VCH Advanced Micro- and Nanosystems book series. In 2005, he served as general co-chair of the IEEE MEMS Conference and as general chair of the IEEE Sensors Conference in 2010. Professor Fedder has contributed to over 200 research publications and holds several patents in the MEMS area.

Education

B.S. 1982, Massachusetts Institute of Technology

M.S. 1984, Massachusetts Institute of Technology

Ph.D. 1994, University of California, Berkeley

Research

As information systems have evolved from isolated computational engines to distributed networks, the autonomous ability to gather and act on information is becoming increasingly important. My research is in the interdisciplinary area of MicroElectroMechanical Systems (MEMS): sensor and actuator systems with performance derived from integration of electronics and mechanical structures with features measured in microns to millimeters. Fabrication of the batch-fabricated electromechanical devices and the development of related processes leverage the enormous investment in mature Very-Large-Scale Integrated (VLSI) circuit manufacturing. Benefits of this approach include much lower manufacturing cost, greater miniaturization, greater integration, and in many cases higher performance than can be achieved with conventional methods used to build systems requiring sensors and actuators.

My research focus on integrated MEMS links to a long-term trend to the manufacture of low-cost sensor-and-actuator Application-Specific Integrated Circuits (ASICs). Integrated MEMS technology is becoming pervasive in embedded systems and is continually evolving to be relevant in new applications. A core general direction in my research group is design, fabrication, and testing of microdevices that are made thorugh integration with conventional foundry CMOS processes, which enable on-chip electrostatically actuated microstructures, capacitive and piezoresistive sensors, and polysilicon thermal heaters. Active projects include MEMS system modeling and design methodologies, accelerometers and gyroscopes for motion sensing, an electrothermal microcooler system, ultra-compliant neural probes, piezoelectric energy scavenging for implantable pressure sensors, nonlinear parametric microresonators, and self-healing RF microresonator oscillators and filters. Challenges include system design, process integration, and physical modeling including environmental effects.